NUSACORE MICROELECTRONICS
Semiconductor assembly | Manufacturing scope sheet
Fictional showcase · Sample scope for project planning

Package assembly from engineering samples through pilot and repeat builds.

Typical packages: QFN, DFN and selected leadframe formats
Inputs to prepare: Package outline, die drawing, material requirements and expected volume
Outputs to agree: Build record, inspection results and pilot release criteria

Engineering review
1. Package review: Review the outline, die details, leadframe format and critical dimensions.
2. Pilot assembly: Agree the build flow, wire-bond requirements and inspection criteria for the first lot.
3. Release review: Review the build and inspection records with engineering before repeat production.