CASE STUDY
Transferring final test with less uncertainty
A handover plan for test coverage, correlation and lot disposition.
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Fabless semiconductor devices.
Move an IC design into a packaged, electrically verified pilot lot.
APPLICATION BRIEF
What your team should prepare.
01
Confirm package fit
Bring the die drawing, pad layout, package outline and key material requirements.
02
Plan assembly and test together
Agree who owns the assembly drawing, electrical limits, golden units and test fixtures.
03
Define the pilot release
Confirm sample quantities and the build, inspection and test records needed before repeat production.
ILLUSTRATIVE PROJECT