ILLUSTRATIVE CASE
Qualifying a sensor package for production
From engineering samples to a package flow with documented inspection gates.
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Capabilities
Semiconductor assembly.
Package assembly from engineering samples through pilot and repeat builds.
PROJECT FLOW
What engineering reviews.
01
Package review
Review the outline, die details, leadframe format and critical dimensions.
02
Pilot assembly
Agree the build flow, wire-bond requirements and inspection criteria for the first lot.
03
Release review
Review the build and inspection records with engineering before repeat production.
RELATED PROJECT
See the scope in context.
This illustrative case shows the decisions a buyer and engineering team would work through.
START A CONVERSATION
Tell us what you’re building.
Share your package or board type, expected volume and target date. That gives engineering a clear place to start.