Semiconductor assembly
QFN, DFN and selected leadframe packages.
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Find the right manufacturing scope.
Start with your package or board, then compare what each manufacturing path needs from your team.
CAPABILITY SELECTION
Narrow the options for your build.
Choose the format and work you need. If you know the project stage, it will carry into the enquiry.
4 scopes shown
Final test & sorting
Packaged devices with a defined test plan.
Assembly + final test
An IC needing packaging and electrical verification.
Electronics manufacturing
Industrial boards and selected instrumentation assemblies.
These selections do not match an illustrative scope. Try a different format or work type, or ask engineering to review your requirements.
Engineering supportSIDE-BY-SIDE COMPARISON
Compare what each scope needs.
| Scope | Typical fit | Inputs to prepare | Outputs to agree |
|---|---|---|---|
| Semiconductor assembly | QFN, DFN and selected leadframe packages | Package outline, die drawing and materials | Pilot build and inspection records |
| Final test & sorting | Packaged devices with a defined test plan | Program revision, test limits and golden units | Correlation, yield and bin disposition |
| Assembly + final test | An IC needing packaging and electrical verification | Package and electrical test inputs | Assembly records and final test results |
| Electronics manufacturing | Industrial boards and selected instrumentation assemblies | BOM, board files and test instructions | First article, inspection and test records |
START A CONVERSATION
Tell us what you’re building.
Share your package or board type, expected volume and target date. That gives engineering a clear place to start.