PROCUREMENT
What to include in a semiconductor RFQ
Package, volume, target dates and the information that makes the first review easier.
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Package, volume, target dates and the information that makes the first review easier.
The checks to agree before a test program moves to a new site.
The production records a buyer may ask to see when investigating a lot.
Wire bonding and package assembly for QFN, DFN and selected leadframe formats.
Electrical verification, binning and lot reporting for released devices.
Surface-mount assembly, optical inspection and functional test for industrial boards.
Gather scope, volumes, milestones and available drawings before asking for a quote.
A fictional traceability record from incoming inspection to final lot release.
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FEATURED GUIDES
PROCUREMENT
Package, volume, target dates and the information that makes the first review easier.
Read guideENGINEERING
The checks to agree before a test program moves to a new site.
Read guideQUALITY
The production records a buyer may ask to see when investigating a lot.
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Share your package or board type, expected volume and target date. That gives engineering a clear place to start.