HomeIllustrative case study
Illustrative case study
Qualifying a sensor package for production.
From engineering samples to a package flow with documented inspection gates.
Semiconductor
The project at a glance.
01
The challenge
An industrial sensor team needed to move a QFN device from engineering samples into a repeatable pilot build.
02
The approach
The team reviewed the assembly drawing, agreed the critical dimensions and set acceptance criteria for bond and visual inspection before running the pilot.
03
The illustrative outcome
A pilot release pack brought the build record, inspection results and open actions together for buyer review.
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